Solder Paste Inspection (SPI)
VP9000
World’s Newest 3D-SPI System
The VP9000 uses highly accurate and repeatable 3D imaging to perform complete PCB solder paste analysis. Potential PCB warpage is calculated at each inspection point and automatically compensated for prioritisation to analysis. The combination of features achieve ultra-precise volume measurements with an high accuracy.
Features
High-Speed 100% 3D Solder Paste Inspection
Highly Accurate Solder Paste Volume Measurement (within 2%)
Multiple Resolution Options and 3-Mode Zoom (down to 5µm)
Two Available Machine Sizes to Handle PCBs Ranging from 250mm x 330mm to 460mm x 510mm
User-Friendly Software and Integrated, Touch-Screen Interface
Simple Program Creation from GERBER and/or Mount Data (compatible with ePM)
Full Offline Program Generation
Real-Time Process Monitoring
Data Analysis and Quality Control Software Tools (compatible with Omron Q-Up Navi software)
Glue and Foreign Material Inspection.
Full 3D Data Processing and realization of Industrial 4.0 Smart Factory Solution.
Omron Q-upNavi: Combine SPI, AOI and AXI Result Data Together for True Root-Cause Analysis.
Omron Q-upAuto: Total Quality Control Across the Entire Production Line.
VP9000 is the latest 3D-SPI technology on the market, suitable for tomorrows production environments.
