ICCO EMT

Sample production, NPI, prototyping, small batches production
Lead free, glue printing reflow and wave soldering processes
µBGA, BGA, CSP, QFP, 01005, odd placement capabilities
Conformal coating (dipping, curing)
ICT, X-ray and optical inspection
Burn-in test
Repair and rework capabilities
Wiring activities
Manual assembly, final assembly, vertical integration and customization
Product packing
Setup verification system on AX501 Pick and Place Machine (based on SVS Pro System from Assembleon)