Rapid Pro – First K&S Gen-S Series Automatic Wire Bonder
RAPID™ Pro introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.
Key Features:
• Real-time Process & Performance Monitoring
• Real-time Equipment Health Monitoring
• Advanced Data Analytics & Traceability
• Predictive Maintenance Monitoring & Analysis
• Detection & Enhanced Post bond Inspection
• Latest Response Based Processes
- ProCu-6, ProAu-2, ProAg
- PSP-Cu, PSP-Ag
- ProCu Loop
Bondable Area Configurations:
• RAPID Pro LA (Large Area)
• RAPID Pro ELA (Extended Large Area)
