APAMA C2W – Chip-to-Wafer
The APAMA Chip-to-Wafer (C2W) offers fully Automated solution for Thermo-Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC).
Cost-of-Ownership Advantage
Modular designs allow the flexibility of upgrading from HD FOWLP or HA FC to TCB processes enabling effective cost-of-ownership and preserving the investments of our customers.
C2W Features & Benefits
• Automation
• Control
• Placement Accuracy
• Performance
• Yield Enhancement
• Adaptability
• Cost-of-Ownership Advantage
Enterprise & Consumer Applications
• HBM Memory Stacking
• Network Routers and Switches
• Servers
• High-end PCs and Graphics
• Smartphones and Tablets
