Hybrid
The K&S Hybrid is the first hybrid Flip Chip/passive placement machine with the speed and accuracy needed for cost-effective SiP manufacture.
- Accuracy up to 15 µm CpK > 1.0
- Ultra-low placement defect levels; below 1 dpm
- Output up to 140 K
- 0201m/008004 capability
- Placing thin components without cracking
- Full control of your process
- Full traceability
