Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets.
Kulicke & Soffa’s expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly.
| Advanced Packaging (Flip-Chip) |
Katalyst |
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| Advanced Packaging (TCB) |
Apama C2S |
Apama C2W |
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| Ball Bonder |
Rapid Pro |
ConnX Elite |
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| Electronics Assembly |
iX 502/302 iX 302 |
iFlex |
Hybrid SiP |
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| Wafer Level Bonder |
ATPremier PLUS |
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| Wedge Bonder |
Asterion |
Asterion EV |
